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news / 2002 |
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| Kaparel Provides AdvancedTCA (PICMG 3.0) Full Mesh Backplane and Transition Cards for SUPERCOMM Displays |
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| June 3, 2002 – Waterloo, Ontario |
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Kaparel Corporation announced today that they will have mechanical demonstration backplanes and transition cards for the AdvancedTCA™ (PICMG 3.0) Full Mesh Configuration in the Rittal booth (# 10419 ) at SUPERCOMM in Atlanta, GA. The PICMG 3.0 Specification is the core spec for the AdvancedTCA (Telecomm Computer Architecture) initiative. It will contain the Architectural Guidelines and basic set of specifications for open architecture modular computing components that can be applied to quickly deploy high performance services solutions. The specification is focused on the definition of an architecture that can:
- Enable reduced development time and costs
- Support reduced total cost of ownership
- Provide high levels of service availability (99.999 percent and greater) through the integration of features for resiliency, redundancy, serviceability, and manageability
- Support appropriate scalability of system performance and capacity
- The architecture is tailored to meet the needs of the rapidly changing communications network infrastructure now and in the future
The AdvancedTCA backplanes and transition cards utilize the new ZD style connectors and will be installed in the Rittal AdvancedTCA subrack assembly being show at the Show. This will be the first major industry showing of the new technology aimed at the Telecomm market. Actual functional testing of the AdvancedTCA architecture will be held at a PICMG 3.0 "Plugfest" to be held later in the fall of 2002.
In a release earlier this year Kaparel announced that their Jardon Engineering Division, located in Tustin California, had been awarded the signal integrity analysis and backplane routing contract for the PICMG 3.0 full mesh configuration backplane. The contract deliverables are a set of specifications to be used in the core specification to guide designers in the implementation of boards and backplanes, and ratification of the 3.0 Specification by the PICMG Executive. Jardon Engineering and their Lead Designer, Robert Jardon will also be featured in Rittal’s booth at SUPERCOMM.
Ben Robitaille Chief Technology Officer for Kaparel stated, "Kaparel and Jardon are pleased to be involved in this exciting project. Our previous work undertaken on high-speed backplanes and daughtercards will be beneficial in providing the analysis for AdvancedTCA. " Mr. Robitaille continued, "Kaparel has been a leader in high speed designs for the Telecomm industry with our work on CompactPCI and we are pleased to be on the start-up team for this new technology."
The SUPERCOMM 2002 is the premiere industry show for the communications industry and run from June 3rd to the 5th in Atlanta. |
About Kaparel |
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Kaparel is an ISO 9001:2000 registered company that develops, manufactures, and markets electronic packaging solutions and high-speed backplanes to the global Converging Communications market. From its pioneering work in CompactPCI bridge designs, Kaparel has quickly become a leader in many aspects of high-speed backplane architecture technology and has a library of over 500 high-speed custom designs including AdvanceTCA.
Kaparel's catalog of product includes a complete line of high slot count, hot swap and high availability backplanes and high quality electronic packaging products and services for telecommunications and embedded computer manufacturers. Founded in 1996, Kaparel is based in Waterloo, Ontario - Canada's Technology Triangle and is a part of Rittal International, the world's largest electronic enclosure manufacturer with offices in over 55 countries. |
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Media Contact
Michael Pichna · Marketing Specialist · Kaparel Corporation
T: 519.725.0101 Ext.232 F: 519.725.0414 · E: marketing@kaparel.com · www.kaparel.com
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